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Data Sheet
SML-01 series
lAttention Points In Handlin
This product was developed as a surface mount LED especially suitable for reflow soldering.
Please take care of following points when using this device.
1.DESIGNING OF PCB
As for a recommendable solder pattern, Please refer to Fig-1.
The size and direction of the pad pattern depends on the condition of the PCB,
horough design review is recommended before the final designing.
his product of structured with rear/bottom electrode to be soldered.
The formation of solder fillet is not guaranteed due to its electrode shape
.MOUNTING
his LED was desi ned to fit various mountin machines.
A round type nozzle is recommended for a hollow lens surface.
.SOLDERING
LED products do not contain reinforcement
materials such as glass fillers.
herefore thermal stress b solderin reatl
influence its reliability.
The temperature conditions for reflow soldering
should therefore be set up according to the
characteristic of this product. (See Fig-2)
Number of reflow process shall be max 2 times
and these processes shall be performed in a row.
Cooling process to normal temperature. Shall be required
between first and second soldering process.
.WASHING
Please note the following points when washing is required after soldering.
4-1) WASHING SOLVENT
so ro l alcohol or other alcohol solvent is recommendable.
4-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
4-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
4-4) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion as atmos here ma de enerate the latin surface which mi ht cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
Min.1 min Max. 40sec
Max.250篊, Within
140 to 180篊
210 to
(Fig-2)
1.5m
1.45
1.45
PCB Bonding Direction
1.6m
(Fig-1)
8/9
2013.08 - Rev.C
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